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ISRO ICRB Scientist Engineer Syllabus 2026, Exam Pattern, Exam Date 2026
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ISRO ICRB Scientist Engineer Syllabus 2026, Exam Pattern, Exam Date 2026
ISRO ICRB Scientist Engineer Syllabus 2026 - Overview
| Organization Name | ISRO Centralised Recruitment Board(ICRB) |
| Post Name | Scientist/Engineer ‘SC’ (Electronics, Mechanical & Computer Science) |
| Total Vacancies | 175 |
| Application Mode | Online |
| Category | Syllabus and Exam Pattern |
| Pay Scale | Rs.56,100/month (Level 10 of Pay Matrix) |
| Job Location | All India |
| Selection Process | Written Test followed by Interview |
| Official Website | https://www.isro.gov.in |
ISRO ICRB Scientist Engineer Syllabus 2026
Part A: Electronics and Communication Engineering :
Networks, Signals, and Systems :-
Circuit analysis: Node and mesh analysis, superposition, Thevenin’s theorem, Norton’s theorem, reciprocity. Sinusoidal steady state analysis: phasors, complex power, maximum power transfer. Time and frequency domain analysis of linear circuits: RL, RC, and RLC circuits, solution of network equations using Laplace transform. Linear 2-port network parameters, wye-delta transformation.
Continuous-time signals: Fourier series and Fourier transform, sampling theorem and applications.
Discrete-time signals: DTFT, DFT, z-transform, discrete-time processing of continuous-time signals. LTI systems: definition and properties, causality, stability, impulse response, convolution, poles and zeroes, frequency response, group delay, phase delay.
Electronic Devices :-
Energy bands in intrinsic and extrinsic semiconductors, equilibrium carrier concentration, direct and indirect band-gap semiconductors.
Carrier transport: diffusion current, drift current, mobility and resistivity, generation and recombination of carriers, Poisson and continuity equations.
P-N junction, Zener diode, BJT, MOS capacitor, MOSFET, LED, photo diode and solar cell.
Analog Circuits :-
Diode circuits: clipping, clamping, and rectifiers.
BJT and MOSFET amplifiers: biasing, ac coupling, small signal analysis, frequency response. Current mirrors and differential amplifiers.
Op-amp circuits: Amplifiers, summers, differentiators, integrators, active filters, Schmitt trigger,s and oscillators.
Digital Circuits :-
Number representations: binary, integer and floating-point- numbers. Combinatorial circuits: Boolean algebra, minimization of functions using Boolean identities and Karnaugh map, logic gates and their static CMOS implementations, arithmetic circuits, code converters, multiplexers, decoders.
Sequential circuits: latches and flip-flops, counters, shift-registers, finite state machines, propagation delay, setup and hold time, critical path delay.
Data converters: sample and hold circuits, ADCs, and DACs.
Semiconductor memories: ROM, SRAM, DRAM.
Computer organization: Machine instructions and addressing modes, ALU, data-path, and control unit, instruction pipelining.
Control Systems :-
Basic control system components: Feedback principle; Transfer function; Block diagram representation; Signal flow graph; Transient and steady-state analysis of LTI systems; Frequency response; Routh-Hurwitz and Nyquist stability criteria; Bode and root-locus plots; Lag, lead and lag- lead compensation; State variable model and solution of state equation of LTI systems.
Communications :-
Random processes: autocorrelation and power spectral density, properties of white noise, filtering of random signals through LTI systems.
Analog communications: amplitude modulation and demodulation, angle modulation and demodulation, spectra of AM and FM, super heterodyne receivers.
Information theory: entropy, mutual information, and channel capacity theorem.
Digital communications: PCM, DPCM, digital modulation schemes (ASK, PSK, FSK, QAM), bandwidth, inter-symbol interference, MAP, ML detection, matched filter receiver, SNR, and BER.
Fundamentals of error correction, Hamming codes, and CRC.
Electromagnetics :-
Maxwell’s equations: differential and integral forms and their interpretation, boundary conditions, wave equation, Poynting vector.
Plane waves and properties: reflection and refraction, polarization, phase and group velocity, propagation through various media, skin depth.
Transmission lines: equations, characteristic impedance, impedance matching, impedance transformation, S-parameters, Smith chart.
Rectangular and circular waveguides, light propagation in optical fibers, dipole and monopole antennas, and linear antenna arrays.
Mechanical :
Materials, Manufacturing, and Industrial Engineering :
Casting, Forming, and Joining Processes: Different types of castings, design of patterns, molds, and cores; solidification and cooling; riser and gating design. Plastic deformation and yield criteria; fundamentals of hot and cold working processes; load estimation for bulk (forging, rolling, extrusion, drawing) and sheet (shearing, deep drawing, bending) metal forming processes; principles of powder metallurgy. Principles of welding, brazing, soldering, and adhesive bonding.
Machining and Machine Tool Operations: Mechanics of machining; basic machine tools; single and multi-point cutting tools, tool geometry and materials, tool life and wear; economics of machining; principles of non-traditional machining processes; principles of work holding, jigs and fixtures; abrasive machining processes; NC/CNC machines and CNC programming.
Metrology and Inspection: Limits, fits and tolerances; linear and angular measurements; comparators; interferometry; form and finish measurement; alignment and testing methods; tolerance analysis in manufacturing and assembly; concepts of coordinate-measuring machine (CMM).
Computer Integrated Manufacturing: Basic concepts of CAD/CAM and their integration tools; additive manufacturing.
Production Planning and Control: Forecasting models, aggregate production planning, scheduling, materials requirement planning, lean manufacturing.
Inventory Control: Deterministic models; safety stock inventory control systems.
Operations Research: Linear programming, simplex method, transportation, assignment, network flow models, simple queuing models, PERT, and CPM
Engineering Materials: Structure and properties of engineering materials, phase diagrams, heat treatment, and stress-strain diagrams for engineering materials.
Applied Mechanics and Design :
Theory of Machines: Displacement, velocity, and acceleration analysis of plane mechanisms; dynamic analysis of linkages, cams, gears, and gear trains, flywheels and governors; balancing of reciprocating and rotating masses; gyroscope.
Vibrations: Free and forced vibration of single-degree-of-freedom systems, the effect of damping, vibration isolation, resonance, and critical speeds of shafts.
Machine Design: Design for static and dynamic loading; failure theories; fatigue strength and the S-N diagram; principles of the design of machine elements such as bolted, riveted, and welded joints; shafts, gears, rolling and sliding contact bearings, brakes, and clutches, springs.
Engineering Mechanics: Free-body diagrams and equilibrium; friction and its applications including rolling friction, belt-pulley, brakes, clutches, screw jack, wedge, vehicles, etc.; trusses and frames; virtual work; kinematics and dynamics of rigid bodies in plane motion; impulse and momentum (linear and angular) and energy formulations; Lagrange’s equation.
Mechanics of Materials: Stress and strain, elastic constants, Poisson’s ratio; Mohr’s circle for plane stress and plane strain; thin cylinders; shear force and bending moment diagrams; bending and shear stresses; the concept of shear center; deflection of beams; torsion of circular shafts; Euler’s theory of columns; energy methods; thermal stresses; strain gauges and rosettes; testing of materials with the universal testing machine; testing of hardness and impact strength.
Fluid Mechanics and Thermal Sciences :
Thermodynamics: Thermodynamic systems and processes; properties of pure substances, the behavior of ideal and real gases; zeroth and first laws of thermodynamics, calculation of work and heat in various processes; second law of thermodynamics; thermodynamic property charts and tables, availability and irreversibility; thermodynamic relations.
Applications: Power Engineering: Air and gas compressors; vapor and gas power cycles, concepts of regeneration and reheat. I.C. Engines: Air-standard Otto, Diesel, and dual cycles. Refrigeration and air-conditioning: Vapor and gas refrigeration and heat pump cycles; properties of moist air, psychrometric chart, basic psychrometric processes. Turbomachinery: Impulse and reaction principles, velocity diagrams, Pelton-wheel, Francis and Kaplan turbines; steam and gas turbines.
Fluid Mechanics: Fluid properties; fluid statics, forces on submerged bodies, stability of floating bodies; control-volume analysis of mass, momentum, and energy; fluid acceleration; differential equations of continuity and momentum; Bernoulli’s equation; dimensional analysis; the viscous flow of incompressible fluids, boundary layer, elementary turbulent flow, flow through pipes, head losses in pipes, bends, and fittings; basics of compressible fluid flow.
Heat-Transfer: Modes of heat transfer; one-dimensional heat conduction, resistance concept and electrical analogy, heat transfer through fins; unsteady heat conduction, lumped parameter system, Heisler’s charts; thermal boundary layer, dimensionless parameters in free and forced convective heat transfer, heat transfer correlations for flow over flat plates and through pipes, the effect of turbulence; heat exchanger performance, LMTD and NTU methods; radiative heat transfer, Stefan- Boltzmann law, Wien’s displacement law, black and grey surfaces, view factors, radiation network analysis
Computer Science :
Programming and Data Structures :
Programming in C
Recursion
Arrays, stacks, queues, linked lists, trees, binary search trees, binary heaps, graphs.
Algorithms :
Searching, sorting, and hashing.
Asymptotic worst-case time and space complexity.
Algorithm design techniques: greedy, dynamic programming, and divide-and-conquer.
Graph traversals, minimum spanning trees, shortest paths
Theory of Computation :
Regular expressions and finite automata.
Context-free grammars and push-down automata.
Regular and context-free languages, the pumping lemma.
Turing machines and undecidability.
Compiler Design :
Intermediate code generation, Local optimization,
Data flow analyses: constant propagation, liveness analysis, common subexpression elimination, Lexical analysis, parsing, syntax-directed translation, Runtime environments
Operating System :
concurrency and synchronization.
Deadlock.
CPU and I/O scheduling.
Memory management and virtual memory.
File systems, System calls, processes, threads, inter-process communication,
Databases :
ER-model.
Relational model: relational algebra, tuple calculus, SQL. Integrity constraints, normal forms.
File organization, indexing (e.g., B and B+ trees).
Transactions and concurrency control.
Computer Networks :
Concept of layering: OSI and TCP/IP Protocol Stacks; Basics of packet, circuit and virtual circuit- switching;
Data link layer: framing, error detection, Medium Access Control, Ethernet bridging;
Routing protocols: shortest path, flooding, distance vector and link state routing; Fragmentation and IP addressing, IPv4, CIDR notation, Basics of IP support protocols (ARP, DHCP, ICMP), Network Address Translation (NAT),
Transport layer: flow control and congestion control, UDP, TCP, sockets; Application layer protocols: DNS, SMTP, HTTP, FTP, Email
Digital Logic :
Boolean algebra.
Combinational and sequential circuits.
Minimization.
Number representations and computer arithmetic (fixed and floating point).
Computer Organization and Architecture :
Machine instructions and addressing modes.
ALU, data-path, and control unit.
Instruction pipelining, pipeline hazards.
Memory hierarchy: cache, main memory, and secondary storage; I/O interface (interrupt and DMA mode).
Part B: Aptitude/ Reasoning :
1. Reasoning
2. Logical Reasoning
3. Diagrammatic Reasoning
4. Abstract Reasoning and Deductive Reasoning
ISRO ICRB Scientist Engineer Exam Pattern 2026
Duration : 120 Minutes
| Part | Subject | No.of Question | Marks | Negative Marking | Duration |
| Part A | Mechanical Engineering | 80 | 80 | 0.33 | 90 Minutes |
| Part B | Aptitude/Ability | 15 | 20 | No Negative Marking | 30 Minutes |
| Total | 95 | 100 | 120 Minutes |
Exam Date : Notified Soon
Starting Date of Application Form : 27th August 2026
Last Date of Application Form : 16th September 2026
Total Post : 175